Who We Are

Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to work beyond the cutting-edge, continuously pushing the boundaries of science and engineering to make possible the next generations of technology, join us to Make Possible® a Better Future.

What We Offer

Location:

Hsinchu,TWN

At Applied, we prioritize the well-being of you and your family and encourage you to bring your best self to work. Your happiness, health, and resiliency are at the core of our benefits and wellness programs. Our robust total rewards package makes it easier to take care of your whole self and your whole family. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

You’ll also benefit from a supportive work culture that encourages you to learn, develop and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more about careers at Applied.

Job Summary

As a Manager V ( or IV) , Process Support Engineer within the Advanced Packaging organization, you will lead a team of technical experts focused on enabling advanced semiconductor process technologies. While this role sits within the Advanced Packaging group, prior experience in advanced packaging is not required. We are hiring three managers, each with deep expertise in one of the following areas: Physical Vapor Deposition (PVD), Plasma Etch, and Chemical Mechanical Planarization (CMP) or Chemical Vapor Deposition (CVD).

You will collaborate with global R&D teams and provide on-site support at customer fabs to ensure equipment and process optimization tailored to customer needs. This role combines technical leadership, customer engagement, and team management.

Key Responsibilities

Customer & Technology Engagement

• Engage with TSMC to understand their technology roadmap, interpret needs, and identify opportunities for Applied Materials solutions in advanced packaging.
• Drive the adoption of new technologies at customer sites through demos, on-site evaluations, joint development programs, and new tool qualifications.
• Act as a liaison between customers and business units, ensuring clear communication and delivery of effective solutions.
• Support customers in developing advanced packaging processes for manufacturing cutting-edge semiconductor devices with optimized equipment.

Team & Operational Management

• Lead and manage a team of Process Support Engineers (PSEs) responsible for on-site installation, diagnostics, troubleshooting, and repair of complex systems.
• Oversee operational quality checks and ensure customers are properly trained in system operation and maintenance.
• Manage training and certification programs for PSEs within their assigned areas.
• Own demand planning and financial forecasting to support business and operational goals.

Technical Analysis & Problem Solving

• Design hypothesis-driven experiments and DOE (Design of Experiments), perform statistical analysis, and compile technical reports with high-level conclusions.
• Resolve complex process engineering issues through multi-layered root cause analysis and innovative solutions.
• Apply deep knowledge of industry best practices and regulatory requirements to recommend process or product improvements.

Qualifications

• Master’s degree or PhD in Chemistry, Physics, Materials Engineering, Electrical Engineering, Optoelectronics, or a related field.
• >8 years years of experience in the semiconductor fab or equipment industry, and over 3 years of management experience is a plus .
• Deep technical expertise in one of the following areas:
  • Physical Vapor Deposition (PVD)
  • Plasma Etch
  • Chemical Mechanical Planarization (CMP) or Chemical Vapor Deposition (CVD)
• Proven leadership skills in guiding teams, solving complex problems, and executing strategic projects.
• Excellent interpersonal and communication skills, with the ability to influence senior stakeholders.
• Proficiency in English.

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Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 10% of the Time

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.