台灣應用材料暑期實習專案
**申請資格：大學就學三年以上的在學學生（含碩、博士）；應屆畢業生即將進入職場者請勿投遞；若需繼續升學者請附上入學證明。
**申請文件 : 提供中英文履歷; 中文自傳(同步提供英文版更加分); 學校成績單; 專業認證證照或作品集。
**收件期間 : 2026/2/1 - 2026/4/15 (面試若符合資格，優先給予錄取通知)。

**附加條件：
1. 實習期間：2026/7/1-2026/8/31。
2. 實習期間之交通與住宿需自理。
3. 實習期間，須全程參與，若無法承諾及配合，請勿投遞。
4. 實習尾聲，須提交報告，分享實習成果，方可領取結業證書。並正式納入公司人才庫。
5. 工作待遇：大學生月薪台幣42,000元，碩士生月薪台幣48,000元，博士生月薪台幣53,000元。

Key Responsibilities

Deep Learning-Based Metrology : Develop AI models to predict critical dimensions, especially in z-direction, from imaging data
1. Collect and preprocess imaging data to ground truth
2. Build and train deep learning models
3. Validate accuracy and benchmark against traditional methods
4. Deploy prototype in workflow

Simulation-Based Metrology : Create physics-based models, correlating to imaging data, to predict critical dimensions
1. Develop simulation framework
2. Calibrate parameters with experimental data
3. Run simulations and sensitivity analysis
4. Validate and optimize models

Crystal Ball: An utility to enable efficient missing defect analysis in Wafer Defect Inspection
1. Learn the basics of wafer defect inspection
2. Understand the localization of defects captured by competitions in our tool images
3. Improve the GUI of Crystal Ball, e.g., adding progress bars, wafer map visualization ...etc.
4. Improve input data parser efficiency to support differet formats of data (e.g., csv, images...etc.)

Requirements

Skills:Proficiency in Python coding and problem-solving.
Knowledge:
- Strong understanding of machine learning, deep learning & computer vision.
- Familiarity with semiconductor manufacturing is a plus, but not required.
Experience:
- Hands-on experience applying machine learning or deep learning to real-world applications.
- Experience in computer vision is a plus.
Education: Master or Ph.D. degree in electrical engineering, computer science, or physics.