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Packaging Engineer

Location: Redmond, WA, USA
Compensation:

USD 85,400-168,100 / year

Posted:
4 days
ICO
Mid-Senior Level
Artificial Intelligence (AI)
Data Management
Developer Tools
DevOps
Enterprise Software
Operating Systems
Software

2027 Future Talent Program - Packaging Component Engineer

Location: Wilson, NC, USA
Compensation:

USD 71,900-113,200 / year

Posted:
4 days
IPO
Entry Level
Biotechnology
Health Care
Manufacturing
Medical
Pharmaceutical

Associate Packaging Engineer

Location: Omaha, NE, USA
Compensation:

USD 59k-79k / year + Equity

Posted:
5 days
IPO
Associate
Food & Beverage
Food Processing
Lifestyle
Nutrition
Processed Food

Senior IC Packaging Engineer - EM Simulations

Location: San Francisco, CA, USA; San Diego, CA, USA
Compensation:

USD 230,398-322,556.85 / year + Equity

Posted:
6 days
Senior
Aerospace
Aerospace & Defense
Automotive
Cleantech
Consumer Electronics
Defense & Space
Defense and Space Manufacturing
Electronics
Energy
Engines
Government and Military
Hardware
Manufacturing
Manufacturing & Industrial
Mining
National Security
Natural Resources
Science and Engineering
Solar
Solar Power
Space Travel
Sustainability
Telecommunications
Vehicles
Wind Power

Senior Quantum 3D Integration and Packaging Engineer

Location: Singapore
Posted:
10 days
Senior
Electronics
Manufacturing
Semiconductor
Software

Hardware Engineer - Packaging Engineering

Location: Pondicherry, Puducherry, India
Posted:
10 days
Mid-Senior Level
AR
Communication Equipment
Computer Hardware
Computers
Consumer Electronics
Data Center
Data Storage
Distribution
E-Commerce
Electronic Components
Electronics
Hardware
Hardware Peripherals
Information Technology and Services
IT Services and IT Consulting
Manufacturing
Manufacturing & Industrial
Mobile
Security
Servers
Services
Smart Home
Smartphones
Software
Tablets
Technology
Technology And Computing
VR
Wearables

Senior Specialist Packaging Component Engineer

Location: Wilson, NC, USA
Compensation:

USD 106,200-167,200 / year

Posted:
10 days
IPO
Senior
Biotechnology
Health Care
Medical
Pharmaceutical

Packaging Engineer II

Location: Colorado, USA
Compensation:

USD 80k-120k / year + Equity

Posted:
11 days
Mid-Senior Level

Principal Packaging Engineer

Location: Plymouth, MN, USA; Fridley, MN, USA
Compensation:

USD 124k-186k / year + Equity

Posted:
12 days
Senior

Senior Packaging Engineer

Location: Omaha, NE, USA; Chicago, IL, USA
Compensation:

USD 82k-120k / year + Equity

Posted:
14 days
IPO
Senior
Food & Beverage
Food Processing
Lifestyle
Nutrition
Processed Food

Technology Development Engineer - Hybrid Bonding & Advanced Packaging (Internship)

Location: Singapore
Posted:
15 days
Internship
Electronics
Manufacturing
Semiconductor
Software

Packaging Engineer Throughput & EIC Support

Location: Forest Park, GA, USA
Compensation:

USD 75,800-170,100 / year + Equity

Posted:
18 days
Mid-Senior Level
Health Care
Manufacturing
Medical

Packaging Engineer - Throughput & MES

Location: Forest Park, GA, USA
Compensation:

USD 75,800-170,100 / year + Equity

Posted:
18 days
Mid-Senior Level
Health Care
Manufacturing
Medical

Working Student (f/m/d) - Packaging Engineer in Monheim am Rhein

Location: Monheim am Rhein, Germany
Posted:
20 days
Internship
Biotechnology
Cleaning Products
Cleantech
Energy
Food & Beverage
Health Care
Information Services
Pharmaceutical
Renewable Energy
Service Industry
Sustainability
Wind Power

Packaging Engineer 3

Location: Pune, Maharashtra, India
Posted:
21 days
IPO
Senior

Principal/Senior Principal Engineer, Packaging (Holly Springs)

Location: United States; North Carolina, USA; Holly Springs, NC, USA; Latin America; North Carolina Wesleyan College, Rocky Mount, NC, USA
Compensation:

USD 95k-212,400 / year

Posted:
25 days
Senior
Biotechnology
Health Care
Life Science
Manufacturing
Pharmaceutical
Therapeutics

Advanced Packaging Inspection (Mantis-D) Process Support Engineer

Location: Hwaseong-si, Gyeonggi-do, South Korea
Posted:
1 month
Mid-Senior Level
Electronics
Manufacturing
Semiconductor
Software

Sr. IC Packaging Test Engineer, Silicon Technology (Starlink)

Location: Bastrop, TX, USA
Posted:
1 month
Senior
Aerospace
Artificial Intelligence (AI)
Automotive
Hardware
Industrial
Internet
Manufacturing
Satellite Communication
Space Travel

Shock/Vibration & Packaging Engineer

Location: Taipei City, Taiwan
Posted:
1 month
Mid-Senior Level
AR
Communication Equipment
Computer Hardware
Computers
Consumer Electronics
Data Center
Data Storage
Distribution
E-Commerce
Electronic Components
Electronics
Hardware
Hardware Peripherals
Information Technology and Services
IT Services and IT Consulting
Manufacturing
Manufacturing & Industrial
Mobile
Security
Servers
Services
Smart Home
Smartphones
Software
Tablets
Technology
Technology And Computing
VR
Wearables

Packaging Engineer

Location: Omaha, NE, USA; Chicago, IL, USA
Compensation:

USD 64k-95k / year + Equity

Posted:
1 month
IPO
Associate
Food & Beverage
Food Processing
Lifestyle
Nutrition
Processed Food